Printed wiring board and method for producing the same

Details Printed wiring board and method for producing the same Printed wiring board and method for producing the same

2008-06-25

2011-10-04

Norris, Jeremy (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000

Reexamination Certificate

active

08030577

ABSTRACT:
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

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