Printed wiring board and method for producing the same

Details Printed wiring board and method for producing the same Printed wiring board and method for producing the same

2011-08-09

2011-08-09

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S792000, C174S258000

Reexamination Certificate

active

07994433

ABSTRACT:
A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.

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