Printed wiring board and method for preparing the same

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

428469, 4284722, 428701, 428699, 428698, 428702, 428901, 427304, B32B 300, B32B 900, B05D 304

Patent

active

056816480

ABSTRACT:
The present invention provides a novel printed wiring board which has an insulating substrate. The printed wiring board also has a metal compound layer formed on a surface of the insulating substrate, wherein the metal compound layer is made of a metal compound having a sufficient insulating property and showing a reduction to a metal. The metal compound layer has a surface formed thereon with a metal wiring pattern which is formed by selective reduction of the above metal compound of the metal compound layer. The printed wiring board also has a palladium-displacement plating layer formed on the metal wiring pattern. The printed wiring board also has an electroless plating layer.

REFERENCES:
patent: 3335050 (1967-08-01), Makowski et al.
patent: 4535029 (1985-08-01), Intrater et al.
patent: 4761303 (1988-08-01), Ruszczyk et al.
patent: 4772080 (1988-09-01), Tustison
patent: 5389446 (1995-02-01), Yamanishi et al.

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