Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2008-03-04
2008-03-04
Dinh, Tuan T. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C029S830000, C029S832000, C174S262000
Reexamination Certificate
active
09380994
ABSTRACT:
In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is connected to external connecting terminals (7). The second to (n−1)-th conductive layers (12) are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.
REFERENCES:
patent: 4180608 (1979-12-01), Del
patent: 4729061 (1988-03-01), Brown
patent: 5010641 (1991-04-01), Sisler
patent: 5216278 (1993-06-01), Lin et al.
patent: 5435877 (1995-07-01), Ishii et al.
patent: 5519936 (1996-05-01), Andros et al.
patent: 5541368 (1996-07-01), Swamy
patent: 5576519 (1996-11-01), Swamy
patent: 5583376 (1996-12-01), Sickler et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5636104 (1997-06-01), Oh
patent: 5670250 (1997-09-01), Sanville et al.
patent: 5734560 (1998-03-01), Kamperman et al.
patent: 5744758 (1998-04-01), Takenouchi et al.
patent: 5764485 (1998-06-01), Lebaschi
patent: 5796163 (1998-08-01), Glenn et al.
patent: 6006428 (1999-12-01), Feilchenfeld et al.
patent: 6132853 (2000-10-01), Noddin
patent: 6208525 (2001-03-01), Imasu et al.
patent: 6461896 (2002-10-01), Imasu et al.
patent: 0376100 (1990-07-01), None
patent: 0 692 823 (1996-01-01), None
patent: 0 713 359 (1996-05-01), None
patent: 61-174193 (1986-08-01), None
patent: 3-244194 (1991-10-01), None
patent: 5-335440 (1993-12-01), None
patent: 7-115272 (1995-05-01), None
patent: 07-283538 (1995-10-01), None
patent: 8-31979 (1996-02-01), None
patent: 08-070183 (1996-03-01), None
patent: 08-148824 (1996-06-01), None
patent: 8-186373 (1996-07-01), None
patent: 8-193139 (1996-07-01), None
patent: 8-279571 (1996-10-01), None
patent: 8-298298 (1996-11-01), None
patent: 08-330356 (1996-12-01), None
patent: 08-335781 (1996-12-01), None
patent: 09-008458 (1997-01-01), None
patent: 96-42902 (1996-12-01), None
Kobayashi Hiroyuki
Kondo Mitsuhiro
Minoura Hisashi
Takada Masaru
Tsukada Kiyotaka
Dinh Tuan T.
Ibiden Co. Ltd.
Norris Jeremy C
Synnestvedt & Lechner LLP
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