Printed wiring board and method for manufacturing the same

Details Printed wiring board and method for manufacturing the same Printed wiring board and method for manufacturing the same

2006-09-19

2009-11-10

Vinh, Lan (Department: 1792)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S017000, C216S019000, C029S592100

Reexamination Certificate

active

07615162

ABSTRACT:
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.

REFERENCES:
patent: 3612743 (1971-10-01), Angele et al.
patent: 3791858 (1974-02-01), McPherson et al.
patent: 3935041 (1976-01-01), Goffredo et al.
patent: 3996416 (1976-12-01), Lemke
patent: 4017968 (1977-04-01), Weglin
patent: 4258468 (1981-03-01), Balde
patent: 4510276 (1985-04-01), Leech et al.
patent: 4628598 (1986-12-01), Taylor
patent: 4706167 (1987-11-01), Sullivan
patent: 4715117 (1987-12-01), Enomoto
patent: 4963974 (1990-10-01), Ushio et al.
patent: 4970107 (1990-11-01), Akahoshi et al.
patent: 4978423 (1990-12-01), Durnwirth et al.
patent: 5009959 (1991-04-01), Matsushita et al.
patent: 5021296 (1991-06-01), Suzuki et al.
patent: 5055321 (1991-10-01), Enomoto et al.
patent: 5156732 (1992-10-01), Ogasawara et al.
patent: 5209817 (1993-05-01), Ahmad et al.
patent: 5260518 (1993-11-01), Tanaka et al.
patent: 5264310 (1993-11-01), Kawai
patent: 5322976 (1994-06-01), Knudsen et al.
patent: 5369881 (1994-12-01), Inaba et al.
patent: 5435057 (1995-07-01), Bindra et al.
patent: 5466349 (1995-11-01), Tench et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5502893 (1996-04-01), Endoh et al.
patent: 5517758 (1996-05-01), Nakamura
patent: 5532091 (1996-07-01), Mizutani
patent: 5578341 (1996-11-01), Hirosawa
patent: 5589250 (1996-12-01), Asai et al.
patent: 5648125 (1997-07-01), Cane
patent: 5684333 (1997-11-01), Moriyama
patent: 5699613 (1997-12-01), Chong et al.
patent: 5768107 (1998-06-01), Ouchi et al.
patent: 5800650 (1998-09-01), Anderson et al.
patent: 5826330 (1998-10-01), Isoda et al.
patent: 5827604 (1998-10-01), Uno et al.
patent: 5861076 (1999-01-01), Adlam et al.
patent: 5879568 (1999-03-01), Urasaki et al.
patent: 5929741 (1999-07-01), Nishimura et al.
patent: 5993945 (1999-11-01), Russell et al.
patent: 6098282 (2000-08-01), Frankeny et al.
patent: 6201193 (2001-03-01), Hashimoto
patent: 6204454 (2001-03-01), Gotoh et al.
patent: 6217987 (2001-04-01), Ono et al.
patent: 0 620 703 (1994-10-01), None
patent: 0 675 532 (1995-10-01), None
patent: 2 258 183 (1993-02-01), None
patent: 58-051436 (1983-11-01), None
patent: 63-126297 (1988-05-01), None
patent: 01-119088 (1989-05-01), None
patent: 02-197148 (1990-08-01), None
patent: 03-003297 (1991-01-01), None
patent: 04-055555 (1992-09-01), None
patent: 05-283334 (1993-10-01), None
patent: 05-304362 (1993-11-01), None
patent: 06-260766 (1994-09-01), None
patent: 08-242064 (1994-09-01), None
patent: 06-283860 (1994-10-01), None
patent: 07-147483 (1995-06-01), None
patent: 07-231149 (1995-08-01), None
patent: 07-273431 (1995-10-01), None
patent: 08-139458 (1996-05-01), None
patent: 08-181436 (1996-07-01), None
patent: 08-181438 (1996-07-01), None
patent: 8-222828 (1996-08-01), None
patent: 08-250857 (1996-09-01), None
patent: 08-264942 (1996-10-01), None
patent: 08-279682 (1996-10-01), None
patent: 2003-60342 (2003-02-01), None
patent: 96/17503 (1996-06-01), None
U.S. Appl. No. 11/522,961, filed Sep. 19, 2006, Asai et al.
English Language Abstract of JP 8-181438, Jul. 12, 1996.
English Language Abstract of JP 6-283860, Oct. 7, 1994.
English Language Abstract of JP 8-250857, Sep. 27, 1996.
English Language Abstract of JP 7-231149, Aug. 29, 1995.
English Language Abstract of JP 58-51436, Nov. 16, 1983.
English Language Abstract of JP 4-55555, Sep. 3, 1992.
English Language Abstract of JP 63-126297, May 30, 1988.
English Language Abstract of JP 3-3297, Jan. 9, 1991.
English Language Abstract of JP 7-273431, published Oct. 20, 1995.
English Language Abstract of JP 6-260766, published Sep. 16, 1994.
English Language Abstract of JP 8-242064, published Sep. 17, 1994.
English Language Abstract of JP 7-147483, published Jun. 6, 1995.
English Language Abstract of JP 8-264942, published Oct. 11, 1996.
English Language Abstract of JP 8-181436, published Jul. 12, 1996.
English Language Abstract of JP 8-139458, published May 31, 1996.
English Language Abstract of JP 5-304362, published Nov. 16, 1993.
Machine Translation of JP 05-283334.

Affiliated with

Also associated with

Rating

Printed wiring board and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4138601