Printed wiring board and method for manufacturing the same

Details Printed wiring board and method for manufacturing the same Printed wiring board and method for manufacturing the same

2006-05-25

2009-11-03

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

07612295

ABSTRACT:
In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external connecting layer which is connected to external connecting terminals (7). The second to (n−1)-th conductive layers (12) are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer (13) is coated with the outermost n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

REFERENCES:
patent: 4180608 (1979-12-01), Del
patent: 4729061 (1988-03-01), Brown
patent: 5010641 (1991-04-01), Sisler
patent: 5216278 (1993-06-01), Lin et al.
patent: 5435877 (1995-07-01), Ishii et al.
patent: 5497545 (1996-03-01), Watanabe et al.
patent: 5519936 (1996-05-01), Andros et al.
patent: 5541368 (1996-07-01), Swamy
patent: 5576519 (1996-11-01), Swamy
patent: 5583376 (1996-12-01), Sickler et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5636104 (1997-06-01), Oh
patent: 5670250 (1997-09-01), Sanville, Jr. et al.
patent: 5734560 (1998-03-01), Kamperman et al.
patent: 5744758 (1998-04-01), Takenouchi et al.
patent: 5764485 (1998-06-01), Lebaschi
patent: 5796163 (1998-08-01), Glenn et al.
patent: 5883335 (1999-03-01), Mizumoto et al.
patent: 5936848 (1999-08-01), Mehr et al.
patent: 6006428 (1999-12-01), Feilchenfeld et al.
patent: 6132853 (2000-10-01), Noddin
patent: 6208525 (2001-03-01), Imasu et al.
patent: 6461896 (2002-10-01), Imasu et al.
patent: 376100 (1990-07-01), None
patent: 0 692 823 (1996-01-01), None
patent: 0 713 359 (1996-05-01), None
patent: 61-176193 (1986-08-01), None
patent: 62-186594 (1987-08-01), None
patent: 01-164089 (1989-06-01), None
patent: 3-244194 (1991-10-01), None
patent: 05-267402 (1993-10-01), None
patent: 5-335440 (1993-12-01), None
patent: 07-115272 (1995-05-01), None
patent: 08-186373 (1995-07-01), None
patent: 07-249872 (1995-09-01), None
patent: 7-283538 (1995-10-01), None
patent: 8-31979 (1996-02-01), None
patent: 08-070183 (1996-03-01), None
patent: 8-78574 (1996-03-01), None
patent: 08-148824 (1996-06-01), None
patent: 08-193139 (1996-07-01), None
patent: 8-279571 (1996-10-01), None
patent: 8-298298 (1996-11-01), None
patent: 8-330356 (1996-12-01), None
patent: 08-335781 (1996-12-01), None
patent: 09-008458 (1997-01-01), None
patent: 09-017828 (1997-01-01), None
patent: 09-051172 (1997-02-01), None
patent: 09-064231 (1997-03-01), None
patent: 96-42902 (1996-12-01), None
Machine Translation of JP 08-148824A.
Annotated figure 4 of JP 08-148824A.
Office Action issued by Japanese Patent Office on Sep. 16, 2008 (translation not available), 2 pages.

Affiliated with

Also associated with

Rating

Printed wiring board and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4123479