Printed wiring board and manufacturing method therefor

Details Printed wiring board and manufacturing method therefor Printed wiring board and manufacturing method therefor

2007-05-29

2007-05-29

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

Process

Preplacing solid filler

C228S180220, C228S245000, C228S056300, C257S774000

Reexamination Certificate

active

10927413

ABSTRACT:
A printed wiring board has a circuit substrate6having a conductor circuit5and a through hole60,and also has a joining pin1inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad81.The joining pin is constructed by a joining head portion11having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion12having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material20,etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

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