Printed wiring board and its manufacturing method

Details Printed wiring board and its manufacturing method Printed wiring board and its manufacturing method

2008-09-26

2011-11-29

Norris, Jeremy (Department: 2835)

Metal working

Method of mechanical manufacture

Electrical device making

C029S852000

Reexamination Certificate

active

08065794

ABSTRACT:
The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.

REFERENCES:
patent: 3276977 (1966-10-01), Willmund et al.
patent: 3350498 (1967-10-01), Leeds
patent: 5047114 (1991-09-01), Frisch et al.
patent: 6019878 (2000-02-01), Nidola et al.
patent: 6224737 (2001-05-01), Tsai et al.
patent: 6793796 (2004-09-01), Reid et al.
patent: 7405146 (2008-07-01), Ma
patent: 2004/0134682 (2004-07-01), En et al.
patent: 42 25 961 (1994-02-01), None
patent: 07-27926 (1996-08-01), None
patent: 0 800 336 (1997-10-01), None
patent: 1288992 (1972-09-01), None
patent: 2 214 520 (1989-09-01), None
patent: 51-90475 (1976-08-01), None
patent: 57-116799 (1982-07-01), None
patent: 4-055555 (1988-05-01), None
patent: 02-030769 (1988-07-01), None
patent: 63-158156 (1988-07-01), None
patent: 1-263278 (1989-10-01), None
patent: 2-22887 (1990-01-01), None
patent: 2-182390 (1990-07-01), None
patent: 2-188992 (1990-07-01), None
patent: 2-238691 (1990-09-01), None
patent: 3-3296 (1991-01-01), None
patent: 3-003296 (1991-01-01), None
patent: 4-48099 (1992-02-01), None
patent: 4-174596 (1992-06-01), None
patent: 5-044099 (1993-02-01), None
patent: 5-148662 (1993-06-01), None
patent: 5-287583 (1993-11-01), None
patent: 06-21648 (1994-01-01), None
patent: 6-112649 (1994-04-01), None
patent: 6-112649 (1994-04-01), None
patent: 06-132629 (1994-05-01), None
patent: 06-164149 (1994-06-01), None
patent: 6-232555 (1994-08-01), None
patent: 06-275959 (1994-09-01), None
patent: 06-302963 (1994-10-01), None
patent: 6-302963 (1994-10-01), None
patent: 6-314883 (1994-11-01), None
patent: 7-58201 (1995-03-01), None
patent: 07-106769 (1995-04-01), None
patent: 07-283538 (1995-10-01), None
patent: 07-283538 (1995-10-01), None
patent: 07-283539 (1995-10-01), None
patent: 7-321456 (1995-12-01), None
patent: 7-336017 (1995-12-01), None
patent: 08-153971 (1996-06-01), None
patent: 8-264372 (1996-10-01), None
patent: 8-319597 (1996-12-01), None
patent: 09-083140 (1997-03-01), None
patent: 9-135077 (1997-05-01), None
patent: 09-172261 (1997-06-01), None
patent: 9-199854 (1997-07-01), None
patent: 9-199854 (1997-07-01), None
patent: 9-199855 (1997-07-01), None
patent: 9-199855 (1997-07-01), None
patent: 9-246730 (1997-09-01), None
patent: 09-275273 (1997-10-01), None
patent: 9-289375 (1997-11-01), None
patent: 9-289375 (1997-11-01), None
patent: 09-321434 (1997-12-01), None
patent: 9-331155 (1997-12-01), None
patent: 10-4254 (1998-01-01), None
patent: 10-65340 (1998-03-01), None
patent: 10-107436 (1998-04-01), None
patent: 10-209604 (1998-08-01), None
patent: 10-242639 (1998-09-01), None
patent: 11-004069 (1999-01-01), None
Structuring of Laminated Cu-Polyimide Films via Laser Ablation, IBM Technical Disclosure Bulletin, IBM Corp., Aug. 1994, p. 481, vol. 37, No. 8, New York, US.
Extended European Search Report—EP 08152453.0 dated Apr. 29, 2009.
Extended European Search Report—EP 08152454.8 dated Apr. 29, 2009.
Summons to attend Oral Proceeding—EP 06003716.5 dated Mar. 28, 2011.
Summons to attend.Oral Proceeding—EP 06003704.1 dated Mar. 22, 2011.
Summons to attend Oral Proceeding—EP 06003717.3 dated Mar. 22, 2011.

Affiliated with

Also associated with

Rating

Printed wiring board and its manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board and its manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board and its manufacturing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4296577