Printed wiring board and information processing device...

Details Printed wiring board and information processing device... Printed wiring board and information processing device...

2005-10-04

2010-02-09

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

07659481

ABSTRACT:
A printed wiring board mounted with a BGA package including pads, through holes and leads. The leads are linearly formed with almost the same width as the diameter of each of the pads and through holes and thus have high bonding strength against their peeling against an external force. The pads are provided at an angle of approximately 45 degrees outwardly relative to the through holes and along almost in the direction of application of thermal stress, and thus have high durability against their peeling due to an external force.

REFERENCES:
patent: 5280139 (1994-01-01), Suppelsa et al.
patent: 5484963 (1996-01-01), Washino
patent: 5784262 (1998-07-01), Sherman
patent: 6086386 (2000-07-01), Fjelstad et al.
patent: 6225686 (2001-05-01), Matsuura
patent: 6443739 (2002-09-01), Currie
patent: 7158387 (2007-01-01), Terada et al.
patent: 2000-261110 (2000-09-01), None
patent: 2001-68594 (2001-03-01), None
patent: 2002-329812 (2002-11-01), None

Affiliated with

Also associated with

Rating

Printed wiring board and information processing device... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board and information processing device..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board and information processing device... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4162870