Printed wiring board and information processing apparatus

Details Printed wiring board and information processing apparatus Printed wiring board and information processing apparatus

2006-04-17

2008-11-18

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S764000

Reexamination Certificate

active

07453704

ABSTRACT:
According to one embodiment, a printed wiring board includes, a main body including an obverse side with an obverse wiring layer, and a reverse side with a reverse wiring layer first pads provided on the obverse side in a first region defined thereon, and to be connected to terminals arranged on a surface of a first semiconductor chip, second pads provided on the reverse side in a second region defined thereon and overlapping with the first region, and to be connected to terminals arranged on a surface of a second semiconductor chip, and interlayer wiring electrically connecting those of the first pads, which are located in an overlapping region, to those of the second pads which are located in the overlapping region.

REFERENCES:
patent: 6862192 (2005-03-01), Yashiro
patent: 6958538 (2005-10-01), Lauterbach et al.
patent: 7034387 (2006-04-01), Karnezos
patent: 2002/0079568 (2002-06-01), Degani et al.
patent: 2004/0238209 (2004-12-01), Yuri et al.
patent: 2004/0264103 (2004-12-01), Otsuka et al.
patent: 2001-339037 (2001-12-01), None
patent: 2003-218505 (2003-07-01), None
Japanese Office Action dated Feb. 28, 2006 for Appln. No. 2003-054681.

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