Printed wiring board and electronic device using same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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361736, 361746, 361760, 361779, 361783, 361807, 361809, 174259, 174260, 174255, 174256, 257737, 257738, 257786, 257784, 257787, 257788, 257793, 257778, 257782, 2281231, H05K 118

Patent

active

058447822

ABSTRACT:
A printed wiring board and an electronic device using the same with which the formation of cracks in base portions of projecting external electrodes formed on lands on the printed wiring,board is certainly prevented. With respect to a printed wiring board 11 having lands 16 formed in a wiring pattern where external electrodes 13 are to be formed and a pattern-protecting film 17 having openings 17a where the external electrodes 13 are to be formed, the opening diameter D1 of the openings 17a in the pattern-protecting film 17 is set greater by a predetermined dimension than the external diameter D2 of the lands 16 and a gap is thereby provided between each of the external electrodes 13 and the pattern-protecting film 17 so that the external electrodes 13 and the pattern-protecting film 17 do not make contact with each other and as a result there is no cracking of the external electrodes 13 caused by differential thermal expansion of the external electrodes 13 and the pattern-protecting film 17. An electronic module comprising the electronic device of the invention mounted on a mother board can be widely used by being incorporated into various types of electronic equipment.

REFERENCES:
patent: 4263606 (1981-04-01), Yorikane
patent: 4970571 (1990-11-01), Yamakawa et al.
patent: 5378859 (1995-01-01), Shirasaki et al.
patent: 5539153 (1996-07-01), Schwiebert et al.
patent: 5637832 (1997-06-01), Danner

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