Printed wiring board and electronic apparatus including same

Details Printed wiring board and electronic apparatus including same Printed wiring board and electronic apparatus including same

2008-07-10

2011-10-04

Nguyen, Hoa C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S250000, C361S816000, C361S818000, C361S767000

Reexamination Certificate

active

08030580

ABSTRACT:
A printed wiring board, which may be included in an electronic apparatus, includes a pair of signal pads including a first signal pad and a second signal pad formed on a front side thereof and configured to transmit differential signals, a ground pad formed at a position in proximity to the pair of signal pads, and a via configured to connect the ground pad to a ground pattern formed either on a back side or on an inner layer of the printed wiring board directly or via a lead wire led out from the ground pad. The via is located at a substantially equal position spaced away from the first signal pad and the second signal pad.

REFERENCES:
patent: 2003/0123236 (2003-07-01), McGrath et al.
patent: 2004/0150970 (2004-08-01), Lee
patent: 2005/0202722 (2005-09-01), Regnier et al.
patent: 2006/0091545 (2006-05-01), Casher et al.
patent: 2004-71431 (2004-03-01), None
patent: 2006-156512 (2006-06-01), None
patent: 2006-191006 (2006-07-01), None

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