Printed wiring board and electronic apparatus

Details Printed wiring board and electronic apparatus Printed wiring board and electronic apparatus

2005-02-01

2005-02-01

Lam, Cathy (Department: 1775)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S263000, C420S562000

Reexamination Certificate

active

06849805

ABSTRACT:
A printed wiring board is provided in which lift-off and land peeling do not occur during soldering of an inserted component onto the printed wiring board, and hence pattern breakage does not occur, but with no increase in cost. A plurality of lands6are each formed continuously across surfaces of a substrate and an inner peripheral surface of one of a plurality of soldering through holes5into which leads2of an inserted component3to be mounted onto the printed wiring board are inserted before soldering is carried out, and a solder resist8is coated onto the lands6.

REFERENCES:
patent: 3610811 (1971-10-01), O'Keele
patent: 5048747 (1991-09-01), Clark et al.
patent: 5730932 (1998-03-01), Sarkhel et al.
patent: 6174562 (2001-01-01), Bergstedt
patent: 6175506 (2001-01-01), Takeuchi
patent: 6441312 (2002-08-01), Tanimura et al.
patent: 11-354919 (1999-12-01), None

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