Printed wiring board and electronic apparatus

Details Printed wiring board and electronic apparatus Printed wiring board and electronic apparatus

2011-04-05

2011-04-05

Norris, Jeremy C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S792000

Reexamination Certificate

active

07919716

ABSTRACT:
According to one embodiment, a printed wiring board includes an insulating layer, a first conductor pattern on the insulating layer configured to be a signal line, and a second conductor pattern on the insulating layer. The second conductor pattern includes a larger conductor area than the first conductor pattern, and a slit which allows the second conductor pattern to stretch to follow a thermal expansion of the insulating layer.

REFERENCES:
patent: 6496377 (2002-12-01), Happ et al.
patent: 6657130 (2003-12-01), Van Dyke et al.
patent: 6707685 (2004-03-01), Kabumoto et al.
patent: U 56-96667 (1981-07-01), None
patent: 61-24295 (1986-02-01), None
patent: 02-060185 (1990-02-01), None
patent: 05-299785 (1993-11-01), None
patent: 08-153938 (1996-06-01), None
patent: 2001-210917 (2001-08-01), None
patent: 2002-261402 (2002-09-01), None
patent: 2006-278747 (2006-10-01), None
patent: 2009-111287 (2009-05-01), None
Notice of Reasons for Rejection mailed by Japan Patent Office on Jan. 19, 2010 in the corresponding Japanese patent application No. 2008-304695.
Explanation of Non-English Language References.

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