Printed wiring board and connection configuration of the same

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S749000, C361S760000, C361S771000, C361S793000, C174S254000, C174S255000, C174S256000, C174S259000, C174S261000, C257S678000, C257S782000

Reexamination Certificate

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07974104

ABSTRACT:
A printed wiring board having an insulating base material; a wiring formed on at least one surface of the insulating base material, the wiring forming a predetermined circuit pattern; a first connection terminal portion formed on the surface and electrically connected to the wiring, the first connection terminal portion having a first width; a second connection terminal portion formed on the surface and electrically connected to the wiring, the second connection terminal portion having a second width; and a cover layer configured to cover the wiring and expose the first and the second connection terminal portion.

REFERENCES:
patent: 5374469 (1994-12-01), Hino et al.
patent: 5381030 (1995-01-01), Kasai
patent: 5391874 (1995-02-01), Ellis
patent: 5488542 (1996-01-01), Ito
patent: 5793150 (1998-08-01), Kober et al.
patent: 6081036 (2000-06-01), Hirano et al.
patent: 6384339 (2002-05-01), Neuman
patent: 6591491 (2003-07-01), Fujii et al.
patent: 6797888 (2004-09-01), Ookawa et al.
patent: 7080445 (2006-07-01), Miyake et al.
patent: 7235745 (2007-06-01), Dass et al.
patent: 7312520 (2007-12-01), Furuyama et al.
patent: 2002/0004180 (2002-01-01), Hotta et al.
patent: 2002/0046880 (2002-04-01), Takubo et al.
patent: 2002/0197834 (2002-12-01), Asakawa et al.
patent: 2003/0087037 (2003-05-01), Honda et al.
patent: 2003/0098339 (2003-05-01), Totani et al.
patent: 2003/0106037 (2003-06-01), Moniwa et al.
patent: 2004/0009683 (2004-01-01), Hiraoka et al.
patent: 2004/0036833 (2004-02-01), Monzen
patent: 2004/0075157 (2004-04-01), Konishi et al.
patent: 2004/0081751 (2004-04-01), Nakanishi et al.
patent: 2004/0173891 (2004-09-01), Imai et al.
patent: 2005/0057906 (2005-03-01), Nakatani et al.
patent: 2005/0162484 (2005-07-01), Isono
patent: 2005/0184381 (2005-08-01), Asahi et al.
patent: 2005/0243528 (2005-11-01), Murayama
patent: 2005/0272276 (2005-12-01), Ooyabu
patent: 2006/0055021 (2006-03-01), Yamamoto
patent: 2006/0151863 (2006-07-01), Das et al.
patent: 2006/0154434 (2006-07-01), Das et al.
patent: 2006/0154501 (2006-07-01), Das et al.
patent: 2006/0169485 (2006-08-01), Kawaguchi et al.
patent: 2006/0192278 (2006-08-01), Furuyama et al.
patent: 2006/0226200 (2006-10-01), Banno et al.
patent: 2006/0244177 (2006-11-01), Kaneto et al.
patent: 2006/0244741 (2006-11-01), Kimura et al.
patent: 2006/0268530 (2006-11-01), Nagao et al.
patent: 2007/0000685 (2007-01-01), Inoue
patent: 2007/0010065 (2007-01-01), Das et al.
patent: 2007/0138613 (2007-06-01), Matsumoto et al.
patent: 2007/0217202 (2007-09-01), Sato
patent: 2007/0273045 (2007-11-01), Kitada et al.
patent: 1717147 (2006-01-01), None
patent: 2797971 (1998-07-01), None
patent: 2800691 (1998-07-01), None
patent: 2004-0101000 (2004-12-01), None

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