Printed wiring board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Patent

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Details

174255, 174265, 174266, 361777, 361794, H05K 116, H05K 702, H05K 111

Patent

active

061215546

ABSTRACT:
Connecting pads in pad rows in a signal layer are connected to another signal layer through a plurality of through hole rows each including a plurality of plated through holes that extend through a power source layer. Each of the through hole rows includes a plurality of through holes arranged side by side between each two adjacent pad rows corresponding thereto. These plated through holes each face the space between each two adjacent connecting pads in each corresponding pad row, and are arranged at intervals about twice as long as the intervals between the connecting pads. Each two adjacent through hole rows are located with an offset not smaller than the diameter of each pad in the longitudinal direction of the rows, and the power source layer includes a plurality of clear regions that are cleared of a conductor and penetrated individually by the through holes.

REFERENCES:
patent: 4016463 (1977-04-01), Beall et al.
patent: 4860088 (1989-08-01), Smith et al.
patent: 5309024 (1994-05-01), Hirano
patent: 5511306 (1996-04-01), Denton et al.
patent: 5519580 (1996-05-01), Natarajan et al.
patent: 5708296 (1998-01-01), Bhansali

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