Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-10-20
2008-11-18
Lam, Cathy (Department: 1794)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S761000, C361S766000, C174S260000, C174S261000
Reexamination Certificate
active
07453702
ABSTRACT:
A printed wiring board comprises the insulating layer11(12); at least one resistance element311(312) comprising a metal as a main component has 0.5 to 5 μm of a roughened surface in an arithmetic means height in the one surface, in −Z direction, and 5% to 50% of the arithmetic mean height in average thickness, which is embedded close to a surface on one side of the insulating layer11and a conductive pattern wired surface is composed of the one surface of the resistance element and the one side of the insulating layer11; and the conductive pattern351(352), arranged on the conductive pattern wired surface, is connected to the terminal of the resistance element311(312). With this structure, it is provided the printed wiring board comprising the resistance element having an accurate and stable resistance value in a broader resistance value range.
REFERENCES:
patent: 3801388 (1974-04-01), Akiyama et al.
patent: 4296272 (1981-10-01), Schelhorn
patent: 4437140 (1984-03-01), Ohyama et al.
patent: 4544989 (1985-10-01), Nakabu et al.
patent: 4682414 (1987-07-01), Butt
patent: 5144536 (1992-09-01), Tsukada et al.
patent: 6204454 (2001-03-01), Gotoh et al.
patent: 6219253 (2001-04-01), Green
patent: 6281090 (2001-08-01), Kukanskis et al.
patent: 6542379 (2003-04-01), Lauffer et al.
patent: 6555208 (2003-04-01), Takada et al.
patent: 6707681 (2004-03-01), Suzuki et al.
patent: 7034231 (2006-04-01), Kukanskis et al.
patent: 4-147695 (1992-05-01), None
patent: 09-139608 (1997-05-01), None
patent: 10-79561 (1998-03-01), None
patent: 10-135608 (1998-05-01), None
patent: 11-4056 (1999-01-01), None
DuPont, DuPont Electronic Materials, Printed Board Built-In Elements, Feb. 15, 2002, disclosed at the internet address of http://www.dupont.co.jp/mcm/apri/print/ER.html.
Iwata Toshimasa
Ninomaru Terumasa
Sugiura Takamichi
Tsukada Kiyotaka
Ibiden Co. Ltd.
Lam Cathy
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
LandOfFree
Printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4049988