Printed wiring board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S761000, C361S766000, C174S260000, C174S261000

Reexamination Certificate

active

07453702

ABSTRACT:
A printed wiring board comprises the insulating layer11(12); at least one resistance element311(312) comprising a metal as a main component has 0.5 to 5 μm of a roughened surface in an arithmetic means height in the one surface, in −Z direction, and 5% to 50% of the arithmetic mean height in average thickness, which is embedded close to a surface on one side of the insulating layer11and a conductive pattern wired surface is composed of the one surface of the resistance element and the one side of the insulating layer11; and the conductive pattern351(352), arranged on the conductive pattern wired surface, is connected to the terminal of the resistance element311(312). With this structure, it is provided the printed wiring board comprising the resistance element having an accurate and stable resistance value in a broader resistance value range.

REFERENCES:
patent: 3801388 (1974-04-01), Akiyama et al.
patent: 4296272 (1981-10-01), Schelhorn
patent: 4437140 (1984-03-01), Ohyama et al.
patent: 4544989 (1985-10-01), Nakabu et al.
patent: 4682414 (1987-07-01), Butt
patent: 5144536 (1992-09-01), Tsukada et al.
patent: 6204454 (2001-03-01), Gotoh et al.
patent: 6219253 (2001-04-01), Green
patent: 6281090 (2001-08-01), Kukanskis et al.
patent: 6542379 (2003-04-01), Lauffer et al.
patent: 6555208 (2003-04-01), Takada et al.
patent: 6707681 (2004-03-01), Suzuki et al.
patent: 7034231 (2006-04-01), Kukanskis et al.
patent: 4-147695 (1992-05-01), None
patent: 09-139608 (1997-05-01), None
patent: 10-79561 (1998-03-01), None
patent: 10-135608 (1998-05-01), None
patent: 11-4056 (1999-01-01), None
DuPont, DuPont Electronic Materials, Printed Board Built-In Elements, Feb. 15, 2002, disclosed at the internet address of http://www.dupont.co.jp/mcm/apri/print/ER.html.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4049988

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.