Printed wiring board

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

Patent

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Details

361386, 361387, H05K 100

Patent

active

048598054

ABSTRACT:
A printed circuit board comprises a base plate and a circuit conductor formed on at least one of the opposed surfaces of the base plate. A heat-radiating film is formed on at least a portion of the surface of the circuit conductor, and an insulating film is formed over the exposed surfaces of the heat-radiating film and the circuit conductor. At least one opening is formed in the insulating film, and the opening overlies the heat-radiating film thereby directly exposing the heat-radiating film to ambient atmosphere so as to promote dissipation of heat from the circuit conductor during use of the printed circuit board. The opening in the insulating film may be in the form of a slot or may comprise a pattern of circular or oval openings. The heat-radiating film may be copper or nickel paste, or non-organic material such as aluminum oxide.

REFERENCES:
patent: 3530229 (1970-09-01), Burke, Jr.
patent: 3841905 (1974-10-01), Dixon, III
patent: 4339303 (1982-07-01), Frisch et al.
patent: 4385202 (1983-05-01), Spinelli et al.
patent: 4472762 (1984-09-01), Spinelli et al.
patent: 4481261 (1984-11-01), Johnson et al.
patent: 4594473 (1986-06-01), Inoue et al.
Feeley, J. D. et al.; Conductive Pastes; IBM Technical Disclosure Bulletin; vol. II, No. 7; Dec. 1968.

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