Printed-wiring board

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

Patent

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Details

29846, 361403, H05K 100

Patent

active

047678925

ABSTRACT:
A printed wiring board is made up of an insulating board and a conductor pattern, which has a plurality of lands, disposed on the insulating board and provided with a solder-resist layer formed on the conductor pattern excluding the lands. Solder-resist barriers are disposed on the solder-resist layer in between the lands with the top surface thereof built to a higher level than the surface level of the lands for effectively preventing formation of a solder bridge between adjoining lands.

REFERENCES:
patent: 4088828 (1978-05-01), Yamamoto et al.
patent: 4220810 (1980-09-01), Arai et al.
patent: 4389771 (1983-06-01), Cassidy et al.

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