Printed wiring board

Details Printed wiring board Printed wiring board

1988-02-19

1989-09-19

Robinson, Ellis P.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

428433, 428458, 428480, 428901, 264104, 528271, 528392, 525425, 525433, 525439, B32B 300

Patent

active

048680478

ABSTRACT:
An injection molding resin-type printed wiring board having an electric circuit pattern layer formed integrally on the surface thereof and having reduced warpage. In the printed circuit board, the injection molding resin includes a thermoplastic resin composition essentially comprising polyethylene terephthalate and containing a flaky inorganic reinforcing material. The inorganic reinforcing material comprises single-substance fine mica flakes or a mixture of fine mica flakes and short glass fibers.

REFERENCES:
patent: 3158528 (1964-11-01), Brown
patent: 3258387 (1966-06-01), Brown et al.
patent: 3470045 (1969-09-01), Bronnval et al.
patent: 3523061 (1970-08-01), Purvis
patent: 4273825 (1981-06-01), Nishiyama et al.
patent: 4291084 (1981-09-01), Segal
patent: 4371579 (1983-02-01), McCaskey et al.
patent: 4418241 (1983-11-01), Fujiwara
patent: 4500603 (1985-02-01), Freundlich

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