Printed wiring board

Details Printed wiring board Printed wiring board

1989-08-24

1991-01-15

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428413, 428414, 428418, 428457, 428463, 428901, 361397, 361398, B32B 900

Patent

active

049852949

ABSTRACT:
Composite films for use in printed wiring boards are comprised of an insulating layer and a copper foil laminated thereover, the insulating layer being made up predominantly of a selected epoxy resin and a selected acrylonitrile-butadiene rubber, whereby voidlessness, thickness uniformity and insulation adjustment are enhanced. Also disclosed is a method of producing a printed wiring board using the film by a subtractive process.

REFERENCES:
patent: 4152477 (1979-05-01), Haruta et al.
patent: 4212912 (1980-07-01), Wartusch et al.
patent: 4353954 (1982-10-01), Yamaoka et al.
patent: 4444848 (1984-04-01), Shanefield et al.
patent: 4837086 (1989-06-01), Takahashi et al.

Affiliated with

Also associated with

Rating

Printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-54572