Printed-wireboard photoimaging

Details Printed-wireboard photoimaging Printed-wireboard photoimaging

1990-02-22

1992-09-22

Wityshyn, Michael G.

Coating apparatus

Solid member or material acting on coating after application

118106, 118642, 427369, 430313, B05C 1102

Patent

active

051487659

ABSTRACT:
An improvement in the preparation of printed circuits comprises inserting a deformable layer between the phototool or support layer, and the solder mask. The deformable layer provides a uniform, integral and relatively thin coating of solder mask over circuit components, and results in higher-quality solder joints and lower rejection rates for finished boards.

REFERENCES:
patent: 2018736 (1935-10-01), Norris
patent: 2414125 (1947-01-01), Rheinfrank, Jr.
patent: 4546065 (1985-10-01), Amendola et al.

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