Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1988-10-17
1989-10-03
Bradley, P. Austin
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 68, 439 91, 439591, 439 74, H01R 909
Patent
active
048713163
ABSTRACT:
A high density, high performance and high fidelity connector system that can connect between electronic circuit planes having different wiring densities. The connector has a modular structure that avoids tolerance build-up for large (long) connections between two substrates, or between a substrate and a board. The connector design can accommodate differential temperature coefficients of expansion between the connector materials and the materials of the substrates being connected. The connector can be formed from low cost printed circuit board technology, or its equivalent, and can be configured to have controlled impedance, low crosstalk and wide bandwidth. The angle between surfaces being interconnected can vary from 0 to 360 degrees.
REFERENCES:
patent: 2396725 (1946-03-01), Thomas, Jr.
patent: 2864977 (1958-12-01), Witt et al.
patent: 3215968 (1965-11-01), Herrmann
patent: 3226669 (1985-12-01), Lutz
patent: 3235942 (1966-02-01), Howell et al.
patent: 3430182 (1969-02-01), Blanche
patent: 3601762 (1971-08-01), Eshelman
patent: 3601772 (1971-08-01), Mancini
patent: 3795037 (1974-03-01), Luttmer
patent: 3852878 (1974-12-01), Munro
patent: 3954317 (1976-05-01), Gillssen et al.
patent: 3998513 (1976-12-01), Kobayashi et al.
patent: 4050769 (1977-09-01), Ammon
patent: 4199209 (1980-04-01), Cherian et al.
patent: 4201435 (1980-05-01), Nakamura et al.
patent: 4295700 (1981-10-01), Sado
patent: 4402562 (1983-09-01), Sado
patent: 4408814 (1983-10-01), Takashi et al.
patent: 4533203 (1985-08-01), Feldman et al.
patent: 4552420 (1985-11-01), Elgenbrode
patent: 4752231 (1988-06-01), Olsson
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4806104 (1989-02-01), Cabourne
patent: 4820170 (1989-04-01), Redmond et al.
Gupta Omkarnath R.
Herrell Dennis J.
Bradley P. Austin
Microelectronics and Computer Technology Corporation
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