Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-06-12
2007-06-12
Dinh, Tuan T. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S257000, C174S258000, C361S748000, C361S757000, C361S312000, C361S313000, C361S746000, C361S750000, C361S751000, C361S762000, C361S780000, C361S794000
Reexamination Certificate
active
10743527
ABSTRACT:
A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive layers and insulative layers. The outermost three layers form an interconnect structure constructed of two conductive layers surrounding an insulative-coated conductive layer. The thicknesses of the various layers are optimized to have an increased resistance to mechanical shock resulting from, for instance, a drop onto a hard surface. In addition, the optimized PWB structure has a minimized thickness and an improved resistance to connection failures resulting from cyclical thermal loads.
REFERENCES:
patent: 5718039 (1998-02-01), Saida et al.
patent: 5866240 (1999-02-01), Prabhu et al.
patent: 6165596 (2000-12-01), Chen et al.
patent: 6343001 (2002-01-01), Japp et al.
patent: 6365839 (2002-04-01), Robbins et al.
patent: 6384340 (2002-05-01), Cheng
patent: 6417460 (2002-07-01), Cheng
patent: 6489570 (2002-12-01), Cheng
patent: 6572793 (2003-06-01), Fukui et al.
patent: 6573600 (2003-06-01), Kikuchi et al.
patent: 6747356 (2004-06-01), Ando et al.
patent: 2002/0007966 (2002-01-01), Miller et al.
patent: 2002/0100608 (2002-08-01), Fushie et al.
patent: 2005/0100719 (2005-05-01), Kanakarajan et al.
patent: 1 261 028 (2002-11-01), None
Takagi et al., “Development of Sequential Build-Up Multilayer Printed Wiring Boards in Japan,”IEEE Electrical Insulation Magazine, 2003, vol. 19(5), pp. 27-56.
Watanabe et al., “The New Manufacturing Process for Flat-Surface Printed Wiring Boards and the Applications,” Proceedings of the Electronic Circuits World Convention, Tokyo, 1999, pp. T4-1-1-T4-1-8.
Kartio Ilkka
Kujala Arni
Niemi Ian
Reinikainen Tommi
Ren Wei
Alston & Bird LLP
Dinh Tuan T.
Nguyen Hoa C.
Nokia Corporation
LandOfFree
Printed wire board and associated mobile terminal does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed wire board and associated mobile terminal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wire board and associated mobile terminal will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3808462