Printed wire board and associated mobile terminal

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S257000, C174S258000, C361S748000, C361S757000, C361S312000, C361S313000, C361S746000, C361S750000, C361S751000, C361S762000, C361S780000, C361S794000

Reexamination Certificate

active

10743527

ABSTRACT:
A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive layers and insulative layers. The outermost three layers form an interconnect structure constructed of two conductive layers surrounding an insulative-coated conductive layer. The thicknesses of the various layers are optimized to have an increased resistance to mechanical shock resulting from, for instance, a drop onto a hard surface. In addition, the optimized PWB structure has a minimized thickness and an improved resistance to connection failures resulting from cyclical thermal loads.

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Takagi et al., “Development of Sequential Build-Up Multilayer Printed Wiring Boards in Japan,”IEEE Electrical Insulation Magazine, 2003, vol. 19(5), pp. 27-56.
Watanabe et al., “The New Manufacturing Process for Flat-Surface Printed Wiring Boards and the Applications,” Proceedings of the Electronic Circuits World Convention, Tokyo, 1999, pp. T4-1-1-T4-1-8.

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