Printed substrate for mounting high-power semiconductor chip the

Details Printed substrate for mounting high-power semiconductor chip the Printed substrate for mounting high-power semiconductor chip the

1991-11-06

1994-05-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361752, 361792, 361810, 174 522, H05K 118

Patent

active

053114035

ABSTRACT:
A printed chip-on-board substrate is for mounting a high-power semiconductor chip. As a construction for efficiently releasing or dissipating heat to be generated in the semiconductor chip, the printed substrate has a printed interconnected substrate and a metal plate bonded on a back side of the substrate. The printed interconnected substrate is constructed by forming an interconnected layer on a surface of the substrate. At a mount area where the semiconductor chip is to be mounted, an opening is formed reaching the metal plate. The metal plate covers the opening on the side of the back side and is formed with a thickness capable of providing rigidity sufficient to support thereon at least the semiconductor chip to be mounted.

REFERENCES:
patent: 4285002 (1981-08-01), Campbell
patent: 4486945 (1984-12-01), Aigoo
patent: 4993148 (1991-02-01), Adachi et al.

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