Printed polymer circuit board method

Details Printed polymer circuit board method Printed polymer circuit board method

1986-06-13

1987-09-22

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29846, 174 685, H05K 334

Patent

active

046945725

ABSTRACT:
A method of manufacturing printed circuit boards includes injection molding a polymer component which may include a substrate for a printed circuit, forming circuit runs and circuit pads on the substrate with conductive adhesive, placing circuit components onto the circuit pads and curing the conductive adhesive. The adhesive may be silkscreened onto the polymer substrate. This process obviates the need for the large number of expensive manufacturing steps necessary to produce conventional etched fiberglass printed circuit boards.

REFERENCES:
patent: 3085295 (1963-04-01), Pizzino et al.
patent: 4329779 (1982-05-01), England
patent: 4402135 (1983-09-01), Schweingruber et al.
patent: 4554033 (1985-11-01), Dery et al.
patent: 4584767 (1986-04-01), Gregory
IBM Technical Disclosure Bulletin, vol. 27, No. 5, Oct. 1984, pp. 2937-2938, by E. W. Mace.

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