Printed conductive connectors

Details Printed conductive connectors Printed conductive connectors

2008-04-08

2008-04-08

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S021000, C257SE21001, C029S890100

Reexamination Certificate

active

11062019

ABSTRACT:
Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.

REFERENCES:
patent: 3729819 (1973-05-01), Horie
patent: 3800020 (1974-03-01), Parfet
patent: 4532152 (1985-07-01), Elarde
patent: 4604678 (1986-08-01), Hagner
patent: 4614837 (1986-09-01), Kane et al.
patent: 4985601 (1991-01-01), Hagner
patent: 5114744 (1992-05-01), Cloutier et al.
patent: 5250758 (1993-10-01), Fjelstad et al.
patent: 5276961 (1994-01-01), Matta et al.
patent: 5493074 (1996-02-01), Murata et al.
patent: 5688146 (1997-11-01), McGinley et al.
patent: 5763058 (1998-06-01), Isen et al.
patent: 6010771 (2000-01-01), Isen et al.
patent: 6177921 (2001-01-01), Comiskey et al.
patent: 6248449 (2001-06-01), Watanabe
patent: 6436316 (2002-08-01), Matsumoto
patent: 6449831 (2002-09-01), Komplin et al.
patent: 6619786 (2003-09-01), Cobb et al.
patent: 6639578 (2003-10-01), Comiskey et al.
patent: 6697694 (2004-02-01), Mogensen
patent: 6713389 (2004-03-01), Speakman
patent: 6737589 (2004-05-01), Adachi et al.
patent: 6743319 (2004-06-01), Kydd
patent: 6750547 (2004-06-01), Jeung et al.
patent: 6787811 (2004-09-01), Saito et al.
patent: 2003/0083203 (2003-05-01), Hashimoto et al.
patent: 2003/0185971 (2003-10-01), Saksa et al.
patent: 2003/0209697 (2003-11-01), Orsbon et al.
patent: 2003/0228748 (2003-12-01), Nelson et al.
patent: 2004/0155322 (2004-08-01), Cho et al.
patent: 63-291493 (1988-11-01), None
patent: 64-002392 (1989-01-01), None
patent: 10-64290 (1989-03-01), None
patent: 62-52532 (1994-09-01), None
patent: 2000-163549 (2000-06-01), None
patent: 2002-324966 (2002-11-01), None
patent: 2003-289179 (2003-10-01), None
patent: WO 01/03183 (2001-01-01), None
patent: WO 02/054841 (2002-07-01), None

Affiliated with

Also associated with

Rating

Printed conductive connectors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed conductive connectors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed conductive connectors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3930973