Printed circuits prepared from metallized photoadhesive layers

Details Printed circuits prepared from metallized photoadhesive layers Printed circuits prepared from metallized photoadhesive layers

1982-09-29

1984-06-12

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427203, 427436, 430198, 430291, 204 38B, H05K 318

Patent

active

044541686

ABSTRACT:
Process for preparation of printed circuits by applying particulate metal to tacky image areas, optionally removing excess particulate metal, and contacting the metallized image areas with an aqueous solution comprising cations of a plating metal to accomplish a metal-metal ion displacement reaction, the solution being substantially free of any chemical reducing agent for said cations. Preferably the conductive circuit is electroplated or soldered.

REFERENCES:
patent: 3226256 (1965-12-01), Schneble et al.
patent: 3259559 (1966-07-01), Schneble et al.
patent: 3332860 (1967-07-01), Diebold
patent: 3664933 (1972-05-01), Clauss
patent: 3716462 (1973-02-01), Jensen
patent: 4171393 (1979-10-01), Donley et al.
patent: 4385082 (1983-05-01), Eichelberger
patent: 4404237 (1983-09-01), Eichelberger

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