Printed circuits prepared from filled epoxy compositions

Details Printed circuits prepared from filled epoxy compositions Printed circuits prepared from filled epoxy compositions

2007-04-03

2010-02-09

Lam, Cathy (Department: 1794)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C174S258000, C361S750000, C428S323000, C428S325000, C428S901000

Reexamination Certificate

active

07658988

ABSTRACT:
Compositions and processes for the preparation of printed circuits from epoxy compositions are provided. The epoxy compositions exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state. The low dielectric constant compositions of the invention are well-suited for use in multi-layer printed circuit boards.

REFERENCES:
patent: 4798762 (1989-01-01), Okada et al.
patent: 4994316 (1991-02-01), Browne et al.
patent: 5055342 (1991-10-01), Markovich et al.
patent: 5126192 (1992-06-01), Chellis et al.
patent: 5670250 (1997-09-01), Sanville et al.
patent: 5677045 (1997-10-01), Nagai et al.
patent: 5888627 (1999-03-01), Nakatani
patent: 6038133 (2000-03-01), Nakatani et al.
patent: 6042936 (2000-03-01), Kempf
patent: 6207259 (2001-03-01), Iino et al.
patent: 6359235 (2002-03-01), Hayashi
patent: 6562179 (2003-05-01), Ikeguchi et al.
patent: 6797345 (2004-09-01), Okamoto et al.
patent: 6798121 (2004-09-01), Nakatani et al.
patent: 6805958 (2004-10-01), Nakamura et al.
patent: 6855892 (2005-02-01), Komatsu et al.
patent: 7488895 (2009-02-01), Hayashi et al.
patent: 2005/0129895 (2005-06-01), Nakamura
patent: 02263858 (1990-10-01), None
Cochrane et al., Hydrophobic Fumed Silica Control of Epoxy Rheology, Modern Paint and Coatings, 1983, p. 1-6, Oct. 1983.

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