Printed circuits and base materials having low Z-axis thermal ex

Details Printed circuits and base materials having low Z-axis thermal ex Printed circuits and base materials having low Z-axis thermal ex

1991-05-13

1993-11-23

Beck, Shrive

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

427 96, 427 97, 427 98, 4274071, C23C 2600

Patent

active

052640655

ABSTRACT:
A base material for printed wiring boards is formed by laminating together layers of prepregs of woven cloth impregnated with a thermosetting polymeric resin varnish. The varnish has an inorganic filler which is present in an amount sufficient to provide the base material with an average coefficient of thermal expansion along its Z-axis between 30.degree. C. and 270.degree. C. which is equal to or less than the coefficient of thermal expansion of copper from 30.degree. C. to 270.degree. C. plus the maximum elongation at 270.degree. C. of copper suitable for forming a conductive pattern on hole walls of printed wiring boards. Printed wiring boards manufactured on the base material by additive or subtractive processes are resistant to failure from thermal stress or thermal cycling.

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patent: 4287253 (1981-09-01), Leech
patent: 4791248 (1988-12-01), Oldenettel
patent: 4800461 (1989-01-01), Dixon
patent: 5080958 (1992-01-01), Patterson

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