Printed circuit substrate with resistance elements

Electrical resistors – With base extending along resistance element – Resistance element and/or terminals printed or marked on base

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Details

29829, 156625, 338311, 338314, 427 96, H01C 1012

Patent

active

042041872

ABSTRACT:
In a printed circuit substrate incorporating a resistor pattern film and a conductor pattern film are formed on the two surfaces of a high conductive material layer such as a copper foil, respectively, in a predetermined positional relationship, and an insulating support is combined directly or indirectly with the resistor pattern film on the high conductive material layer, whereby a printed circuit board with resistance elements having high performance can be manufactured, while the number of processing steps can be greatly reduced.

REFERENCES:
patent: 3256588 (1966-06-01), Sikoua et al.
patent: 3287191 (1966-11-01), Borth
patent: 3390992 (1968-07-01), Valles
patent: 3864180 (1975-02-01), Barraclough
patent: 3904461 (1975-09-01), Estep et al.
patent: 4025404 (1977-05-01), Joly et al.
patent: 4077854 (1978-03-01), Estep et al.
J. G. Ameen, et al., IBM Technical Disclosure Bulletin, "Thin Film Resistors on Metallized Substrate," vol. 21, No. 3, pp. 953-954, Aug. 1978.

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