Metal fusion bonding – Process – Plural joints
Patent
1994-05-20
1995-12-26
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228175, 228106, 228214, H05K 334
Patent
active
054780063
ABSTRACT:
A printed-circuit substrate is provided with: a film-shaped support base having an electrical insulating property and elasticity, which includes a resin mold section for supporting an IC; a plurality of foil-shaped electrodes which are connected to the IC and supported by the support base in such a manner as to extend toward the periphery of the support base; and an exposed portion which is provided by removing the support base in the direction orthogonal to the foil-shaped electrodes over an entire area of the support base between the IC chip and the periphery thereof so as to expose one portion of each foil-shaped electrode. In the case of connecting the foil-shaped electrodes to electrodes of a printed-circuit substrate by means of soldering, the tips of the foil-shaped electrodes are soldered to the respective electrodes by applying heat and pressure to a part of the support base located on the tip-side of the exposed portions of the foil-shaped electrodes. This arrangement makes it possible to improve the pliability of the exposed portion; therefore, even if the support base is miniaturized to have a thin width by shortening the exposed portion, the reliability of the connecting structure is improved between the tips of the foil-shaped electrodes and the electrodes.
REFERENCES:
patent: 4633274 (1986-12-01), Matsuda
patent: 5164815 (1992-11-01), Lim
patent: 5355018 (1994-10-01), Fierkens
Conlin David G.
Heinrich Samuel M.
Oliver Milton
Sharp Kabushiki Kaisha
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