Wave transmission lines and networks – Long line elements and components – Strip type
Patent
1986-07-01
1988-04-12
Gensler, Paul
Wave transmission lines and networks
Long line elements and components
Strip type
29610R, 338309, 338314, 333128, 333 22R, H01P 100, H01P 126
Patent
active
047377470
ABSTRACT:
A resistive element is formed on a printed circuit board using only printed circuit board fabrication techniques. Two printed circuit board strata are laminated together into a multi-layer printed circuit board. A desired trace pattern is etched into a first layer of a first stratum that has first and second conductive metallic layers clad to opposing sides of a first dielectric substrate. A bi-metallic clad substrate having a resistive layer clad to a first side of a second dielectric substrate, a third conductive layer clad to the resistive layer, and a fourth conductive layer clad to a second side of the second dielectric substrate represents the second stratum. The third conductive layer is etched to leave only pads. The resistive layer is etched to form resistive elements of desired resistivity between the pads. When the two strata are laminated together, the pads couple to the trace pattern at desired locations.
REFERENCES:
patent: 3354412 (1967-11-01), Steidlitz
patent: 3541474 (1970-11-01), Holton
patent: 3585533 (1971-06-01), Denhard
patent: 3678417 (1972-07-01), Ragan
patent: 4396900 (1983-08-01), Hall
patent: 4450418 (1984-05-01), Yum et al.
patent: 4616413 (1986-10-01), Iliou et al.
Design & Process Guide, Ohmega Foil Clad RT/duroid Laminates, Rogers Corp, Microwave Materials Division, pp. 1-13.
Gibbs Terry L.
Henderson James M.
Gensler Paul
Jones, Jr. Maurice J.
Motorola Inc.
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