Printed circuit patterned embedded capacitance layer

Details Printed circuit patterned embedded capacitance layer Printed circuit patterned embedded capacitance layer

2006-11-21

2006-11-21

Norton, Nadine (Department: 1765)

Etching a substrate: processes

Nongaseous phase etching of substrate

C257S773000, C438S381000, C438S778000, C438S793000, C438S794000, C438S791000

Reexamination Certificate

active

07138068

ABSTRACT:
A method is disclosed for fabricating a patterned embedded capacitance layer. The method includes fabricating (1305, 1310) a ceramic oxide layer (510) overlying a conductive metal layer (515) overlying a printed circuit substrate (505), perforating (1320) the ceramic oxide layer within a region (705), and removing (1325) the ceramic oxide layer and the conductive metal layer in the region by chemical etching of the conductive metal layer. The ceramic oxide layer may be less than 1 micron thick.

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