Printed circuit packaging for high vibration and temperature env

Details Printed circuit packaging for high vibration and temperature env Printed circuit packaging for high vibration and temperature env

1986-10-01

1988-09-06

Briggs, William R.

Metal working

Method of mechanical manufacture

Electrical device making

H05K 330

Patent

active

047682868

ABSTRACT:
A method for manufacturing a reusable package for printed circuits boards in oil tools which is protected from high vibration and high temperature environments is comprised of the steps of vacuum forming a thin layer of mold release film over the printed circuit board. The printed circuit board together with its intimately formed mold release film is then potted in a conventional manner within a protective package filled with a resilient curable foam. The foam is poured in an uncured state around the components of the printed circuit board and cured in place. After the potting material is cured the printed circuit board is removed from the resilient potting material and the mold release layer is stripped from the printed circuit board. Thereafter the printed circuit board is reassembled in the conformally molded resilient potting and additional foam may be added to the printed circuit board and the electronic packaging to gently urge the printed circuit board into intimate conformal contact with the conformally mated potting. The electronic package is then completed or enclosed in a conventional manner with the printed circuit board snugly retained within the conformally molded potting.

REFERENCES:
patent: 3579821 (1971-05-01), Kurisu
patent: 4063349 (1977-12-01), Passler et al.
patent: 4118861 (1978-10-01), Palmisano

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