Printed circuit manufacturing process using tin-nickel plating

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

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C25D 502

Patent

active

060154829

ABSTRACT:
A process for manufacturing a printed circuit that replaces tin and/or tin-lead electroplating with tin-nickel based electroplating. The process includes printing a desired circuitry pattern onto a resist-coated copper-clad substrate. A tin-nickel material is electroplated onto the desired circuitry pattern, and the resist removed. The tin-nickel electroplating takes place within a bath comprised of a nickel source, a stannous source and a starter solution including a bifluoride salt, diethylenetriamine and triethylenetetramine.

REFERENCES:
patent: 3772168 (1973-11-01), Dillenberg
patent: 3887444 (1975-06-01), Fueki et al.
patent: 4033835 (1977-07-01), Lerner et al.
patent: 4049508 (1977-09-01), Morrissey
patent: 4081336 (1978-03-01), Eppensteiner et al.
patent: 4088545 (1978-05-01), Supnet
patent: 4104111 (1978-08-01), Mack
patent: 4283248 (1981-08-01), Kakuhashi et al.
patent: 4368252 (1983-01-01), Kakuhashi et al.
patent: 4640747 (1987-02-01), Ueno et al.
patent: 4666739 (1987-05-01), Roubal
patent: 4828657 (1989-05-01), Fukuoka et al.
patent: 4946563 (1990-08-01), Yeatts
patent: 5232575 (1993-08-01), Dodd
patent: 5320919 (1994-06-01), Azuma et al.
patent: 5403465 (1995-04-01), Apperson et al.
patent: 5536908 (1996-07-01), Etchells
Copy of PCT International Search Report mailed on Mar. 18, 1999 (4 pages).

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