Printed circuit manufacture

Details Printed circuit manufacture Printed circuit manufacture

1995-10-03

1997-03-11

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205126, 205184, 205223, 205920, 216 13, 216 17, 216 48, 216 56, 216 65, 216 66, C25D 502, C25D 548, C23C 2802

Patent

active

056097468

ABSTRACT:
In the manufacture of a printed circuit board a sacrificial tin-lead layer is deposited on the surface of the board by electroplating. Holes are then formed in the board by UV laser ablation. Debris from the ablation process is adsorbed on the sacrificial layer. The sacrificial layer is then removed by means of a chemical stripping process, along with the debris.

REFERENCES:
patent: 3163588 (1964-12-01), Shortt et al.
patent: 3171796 (1965-03-01), Stephens et al.
patent: 3867217 (1975-02-01), Maggs et al.
patent: 4023998 (1977-05-01), Cederberg
patent: 4389993 (1983-08-01), Hume, Jr.
patent: 4644130 (1987-02-01), Backmann
patent: 4705592 (1987-11-01), Bahrle et al.
patent: 4948941 (1990-08-01), Altman
patent: 5158645 (1992-10-01), Covert et al.

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