Printed circuit having ground vias between signal vias

Details Printed circuit having ground vias between signal vias Printed circuit having ground vias between signal vias

2009-10-01

2011-12-20

Thompson, Timothy J (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

08080738

ABSTRACT:
A printed circuit includes a substrate having a pair of opposite sides. A signal via extends through at least one of the sides and at least partially through the substrate between the sides. Aggressor vias extend through at least one of the sides and at least partially through the substrate between the sides. The aggressor vias are arranged in a pattern around the signal via. Linear paths are defined between the signal via and the aggressor vias. At least some of the aggressor vias are arranged along the substrate directly adjacent the signal contact. Ground vias extend through at least one of the sides and at least partially through the substrate between the sides. The ground vias are arranged around the signal via. At least one ground via is positioned along each linear path between the signal via and each of the aggressor vias that is directly adjacent the signal via.

REFERENCES:
patent: 5331514 (1994-07-01), Kuroda
patent: 6641411 (2003-11-01), Stoddard et al.
patent: 7217889 (2007-05-01), Parameswaran et al.
patent: 2006/0228912 (2006-10-01), Morlion et al.

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