Printed circuit having a dielectric covercoat

Details Printed circuit having a dielectric covercoat Printed circuit having a dielectric covercoat

1994-06-30

1995-09-12

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361792, 361813, 439 67, 428209, 29843, 26427211, 174254, H05K 100

Patent

active

054502861

ABSTRACT:
A printed circuit assembly includes a rigidizer having first and second opposing surfaces, a silicone bonding agent disposed over a first surface of the rigidizer, a flex circuit having first and second opposing surfaces with a first surface of the flex circuit disposed over the bonding agent, and a silicone covercoat disposed over selected portions of the second surface of the flex circuit.

REFERENCES:
patent: 3909680 (1975-09-01), Tsunashima
patent: 4413308 (1983-11-01), Brown
patent: 4520382 (1985-05-01), Shimura
patent: 4829353 (1989-05-01), Tei
patent: 4988403 (1991-01-01), Matuo
patent: 4994316 (1991-02-01), Brome et al.
patent: 5111363 (1992-05-01), Yagi et al.
patent: 5153051 (1992-10-01), Dorinski
IBM Technical Disclosure Bulletin, Smith and Zipay, Lamination on Contoured Surfaces, Sep. 1971, vol. 14, No. 4, p. 1313.

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