Printed circuit embedded capacitors

Details Printed circuit embedded capacitors Printed circuit embedded capacitors

2006-06-06

2006-06-06

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Making passive device

C361S301100

Reexamination Certificate

active

07056800

ABSTRACT:
One of a plurality of capacitors embedded in a printed circuit structure includes a first electrode (415) overlaying a first substrate layer (505) of the printed circuit structure, a crystallized dielectric oxide core (405) overlaying the first electrode, a second electrode (615) overlying the crystallized dielectric oxide core, and a high temperature anti-oxidant layer (220) disposed between and contacting the crystallized dielectric oxide core and at least one of the first and second electrodes. The crystallized dielectric oxide core has a thickness that is less than 1 micron and has a capacitance density greater than 1000 pF/mm2. The material and thickness are the same for each of the plurality of capacitors. The crystallized dielectric oxide core may be isolated from crystallized dielectric oxide cores of all other capacitors of the plurality of capacitors.

REFERENCES:
patent: 5027253 (1991-06-01), Lauffer et al.
patent: 5261153 (1993-11-01), Lucas
patent: 5796587 (1998-08-01), Lauffer et al.
patent: 6005777 (1999-12-01), Bloom et al.
patent: 6407929 (2002-06-01), Hale et al.
patent: 6541137 (2003-04-01), Dunn et al.
patent: 2003/0113443 (2003-06-01), Kingon et al.
patent: 2004/0047112 (2004-03-01), Yoshida et al.
patent: 2004/0118600 (2004-06-01), Lee et al.

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