Electricity: electrical systems and devices – Miscellaneous
Patent
1987-06-02
1989-03-21
Kucia, R. R.
Electricity: electrical systems and devices
Miscellaneous
206328, 174 524, 174 522, 174 523, H05K 118
Patent
active
048149438
ABSTRACT:
A printed circuit device including semiconductor IC chips on the surface of a printed circuit board made of insulating material. The printed circuit board includes on the surface thereof semiconductor mounting regions and conductive layers. The semiconductor IC chips are respectively fixedly mounted on the semiconductor element mounting regions disposed on the printed circuit board. Thin metal wires interconnect electrodes of the IC chips with the conductive layers. A sealing cover plate having a plurality of recesses formed therein is fixedly mounted onto the surface of the printed circuit board with adhesive for hermetically sealing each of the IC chips and electric wires with a respective one of the recesses in the cover plate. The cover plate can comprise a composite of a thermoplastic resin material layer and a metal layer, such as aluminum or an aluminum alloy.
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Kucia R. R.
OKI Electric Industry Co., Ltd.
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