Printed circuit boards with solderable plating finishes and meth

Details Printed circuit boards with solderable plating finishes and meth Printed circuit boards with solderable plating finishes and meth

1984-03-13

1986-02-25

Grimley, A. T.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29846, 29852, 427 97, H05K 109, H05K 306

Patent

active

045729255

ABSTRACT:
Printed circuit manufacture may employ a plated palladium-nickel alloy layer as an etch resist and plating finish. Prior to the use of palladium-nickel, tin-lead was used as the etch resist and plating finish. The palladium-nickel layer is generally superior to the corresponding tin-lead layer except for solderability. To improve the solderability of at least these areas of the palladium-nickel to which elements are to be soldered, a layer of copper is deposited thereon. If desired, the solderability of the copper may be preserved by coating it with, for example, a tin-lead layer.

REFERENCES:
patent: 4075416 (1978-02-01), Kuttner et al.
patent: 4104111 (1978-08-01), Mack
patent: 4135988 (1979-01-01), Dugan et al.
patent: 4285991 (1981-08-01), Gedrat et al.
patent: 4440823 (1984-04-01), Hoffmann
patent: 4444619 (1984-04-01), O'Hara
patent: 4512829 (1985-04-01), Ohta et al.
Published International Application PCT/US78/00055; WO79/00083; Feb. 1979.

Affiliated with

Also associated with

Rating

Printed circuit boards with solderable plating finishes and meth does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit boards with solderable plating finishes and meth, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit boards with solderable plating finishes and meth will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1013235