Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-12-02
2000-02-01
Tolin, Gerald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361763, 361766, 361782, 174255, 174257, 174258, 428209, 428210, 428901, 29846, H05K 116
Patent
active
060210508
ABSTRACT:
A multi-layered printed circuit board having a plurality of burried passive elements and a method for producing the circuit board wherein the passive elements can include resistors, capacitors and inductors. The method includes the steps of manufacturing individual layers of the multi-layer printed circuit board with electrical circuits thereon and subsequently screening polymer inks having resistive, dielectric or magnetic values to form the resistors, capacitors and inductors. Each layer of the circuit board is cured to dry the polymer ink and thereafter the individual layers are bonded together to form the multi-layer board.
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Electronic Materials and Processes Handbook, 2nd ed., McGraw-Hill, Inc., Harper & Sampson, eds., "Printed-Wiring Boards" by V.J. Brzozowski and C.T. Brooks, pp. 2.5-2.6 and 2.12-2.13, 1994.
Ehman Michael F.
Eslinger Larry L.
Bourns Inc.
Tolin Gerald
Vigushin John B.
LandOfFree
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