Printed circuit boards having improved solder pads

Details Printed circuit boards having improved solder pads Printed circuit boards having improved solder pads

2006-07-18

2006-07-18

Nasri, Javaid H. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

07079399

ABSTRACT:
A printed circuit board having improved solder pads for preventing from short circuit of the printed circuit board caused by axial leads (30, 31) of components engaging the circuit surrounding the soldering pad comprises a pair of through holes (10, 11), a pair of first pads (20, 21) surrounding corresponding through holes and a pair of second pads (40, 41) adjacent corresponding first pads. When components are inserted into the through holes of the printed circuit board using placement machines, bent portions of the axial leads that are extended out of the first pads will fall into the second pads.

REFERENCES:
patent: 5000691 (1991-03-01), Olsson et al.
patent: 5092035 (1992-03-01), McMichen et al.
patent: 5784262 (1998-07-01), Sherman

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