Printed circuit boards having improved adhesion between solder m

Details Printed circuit boards having improved adhesion between solder m Printed circuit boards having improved adhesion between solder m

1986-04-17

1987-12-15

Kittle, John E.

Stock material or miscellaneous articles

Composite

Of metal

428901, 430271, 430275, 430277, 430280, 430214, 430285, B32B 1508, G03C 1495, G03C 168

Patent

active

047132981

ABSTRACT:
A printed circuit board having improved adhesion between solder mask and metal includes a primer film on the metal deposited from an aqueous solution which includes 0.01 to 10% by weight of a carboxyl-containing polymer or copolymer.

REFERENCES:
patent: 3447460 (1969-06-01), Vincent et al.
patent: 4197354 (1980-04-01), Sandera
patent: 4615950 (1986-10-01), Huns et al.

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