Printed circuit boards having improved adhesion between solder m

Details Printed circuit boards having improved adhesion between solder m Printed circuit boards having improved adhesion between solder m

1985-03-15

1986-10-07

Swisher, Nancy A. B.

Stock material or miscellaneous articles

Composite

Of metal

428901, 428462, 428463, 430271, 430277, 430285, 430275, 430280, 430284, B32B 1508

Patent

active

046159509

ABSTRACT:
A printed circuit board having improved adhesion between solder mask and metal includes a primer film on the metal deposited from an aqueous solution which includes 0.01 to 10% by weight of a carboxyl-containing polymer or copolymer.

REFERENCES:
patent: T889027 (1971-08-01), Nadeau
patent: 2978356 (1961-04-01), Gomsi
patent: 3185085 (1965-05-01), Herrick et al.
patent: 3447460 (1969-06-01), Vincent et al.
patent: 3620878 (1971-11-01), Guthrie
patent: 3749637 (1973-07-01), Reardon et al.
patent: 3932689 (1976-01-01), Watanabe et al.
patent: 3948665 (1976-04-01), Richter et al.
patent: 4079159 (1978-03-01), Sano et al.
patent: 4197354 (1980-04-01), Sandera
patent: 4233395 (1980-11-01), Klupfel et al.

Affiliated with

Also associated with

Rating

Printed circuit boards having improved adhesion between solder m does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit boards having improved adhesion between solder m, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit boards having improved adhesion between solder m will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-642944