Printed circuit boards and method of producing the same

Details Printed circuit boards and method of producing the same Printed circuit boards and method of producing the same

2005-08-15

2008-11-11

Norris, Jeremy C (Department: 2841)

Active solid-state devices (e.g., transistors, solid-state diode

Alignment marks

C174S260000

Reexamination Certificate

active

07449791

ABSTRACT:
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.

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Machine Translation of JP 05-283334.
An English Language Abstract of JP 8-181438.
An English Language Abstract of JP 6-283860.
An English Language Abstract of JP 8-250857.
An English Language Abstract of JP 7-231149.
An English Language Abstract of JP 58-51436.
An English Language Abstract of JP 4-55555.
An English Language Abstract of JP 63-126297.
An English Language Abstract of JP 3-3297.
English Language Abstract of JP 7-273431, published Oct. 20, 1995.
English Language Abstract of JP 6-260766, published Sep. 16, 1994.
English Language Abstract of JP 8-242064, published Sep. 17, 1994.
English Language Abstract of JP 7-147483, published Jun. 6, 1995.
English Language Abstract of JP 8-264942, published Oct. 11, 1996.
English Language Abstract of JP 8-181436, published Jul. 12, 1996.
English Language Abstract of JP 8-139458, published May 31, 1996.
English Language Abstract of JP 5-304362, published Nov. 16, 1993.
English language Abstract of JP 08-279682.
English language Abstract of JP 02-197148.
English Language Abstract of JP 01-119088.

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