Printed circuit boards and method of producing the same

Details Printed circuit boards and method of producing the same Printed circuit boards and method of producing the same

2005-08-16

2005-08-16

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C361S802000, C257S797000

Reexamination Certificate

active

06930255

ABSTRACT:
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.

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An English Language Abstract of JP 8-181438.
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An English Language Abstract of JP 8-250857.
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An English Language Abstract of JP 63-126297.
An English Language Abstract of JP 3-3297.

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