Printed circuit boards and heat sink structures

Details Printed circuit boards and heat sink structures Printed circuit boards and heat sink structures

1993-10-08

1995-11-14

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 257713, 361705, H05K 720

Patent

active

054672511

ABSTRACT:
Printed circuit board and heat sink assembly in which heat conductive elements are provided to distribute heat across the board before transferring heat into the heat sink. Also in other structures, heat is conducted directly into a heat sink from surface mount components while bypassing the board.

REFERENCES:
patent: 4729061 (1988-03-01), Brown
patent: 4849856 (1989-07-01), Funari
patent: 4914551 (1990-04-01), Ancchel
patent: 4959900 (1990-10-01), de Givry
patent: 5095404 (1992-03-01), Chao
patent: 5177669 (1993-01-01), Juskey
patent: 5218516 (1993-06-01), Collins
patent: 5223747 (1993-06-01), Tschulena
patent: 5262922 (1993-11-01), Yamaji
patent: 5294826 (1994-03-01), Marcantonio

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