Printed circuit board with vias at fixed and selectable location

Details Printed circuit board with vias at fixed and selectable location Printed circuit board with vias at fixed and selectable location

1986-05-16

1987-10-13

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361416, H05K 100

Patent

active

047000163

ABSTRACT:
A printed circuit board for electric circuits is formed of plural layers of electrical conductors and includes through holes and vias arranged in a regular pattern along points of a grid laid out along othorgonal axes of a Cartesian coordinate system. Electrical components such as circuit chips and discrete components are to be mounted to the through holes, while the vias connect electrical conductors of different layers. Conductors of a layer are grouped together as multiple-conductor channels which are routed among the through holes and the vias to make electrical connections among the electrical components. An additional via can be entered in a central portion of a grid cell by rerouting conductors of channels in the cell through arcuate segments, thereby permitting connection between conductors of channels on different layers while preserving the original grid pattern of through holes and vias.

REFERENCES:
patent: 3726989 (1973-04-01), Lesley
patent: 3895181 (1975-07-01), LaGrange et al.
patent: 4298770 (1981-11-01), Nishihara et al.
patent: 4362899 (1982-12-01), Borrill
patent: 4598166 (1986-07-01), Neese
Girvan, E. J. et al; "Interstitial Vias for Improved Wirability"; IBM Technical Disclosure Bulletin, vol. 26, No. 7A; Dec. '83; p. 3464.

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